Cho-Bond-584-Conductive Adhesive

Cho-Bond 584 Conductive Adhesive

Chomerics’ CHO-BOND 584 two-component, highly conductive adhesive system combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the material is offered in the convenient premeasured “CHO-PAK™” for rapid application.

CHO-BOND 584 adhesive meets the most exacting electrical bonding requirements without the high temperatures, fluxes and expensive preparatory techniques usually needed to obtain effective lead-tin solder joints.

Chomerics’ CHO-BOND 584 two-component, highly conductive adhesive system combines the good adhesive characteristics of epoxy with the superior conductivity of silver. In addition to being available in bulk form, the material is offered in the convenient premeasured “CHO-PAK™” for rapid application.

CHO-BOND 584 adhesive meets the most exacting electrical bonding requirements without the high temperatures, fluxes and expensive preparatory techniques usually needed to obtain effective lead-tin solder joints.

Fully cured CHO-BOND 584 adhesive exhibits a dc volume resistivity of 0.002 ohm-cm and is usable over a wide temperature range. Adhesion to copper, bronze, cold-rolled steel, aluminum, magnesium, kovar, nickel, ceramic, phenolic and plastic is excellent.

When used in machined seams, CHO-BOND 584 adhesive provides an excellent EMI shield; however, it should not be used for shielding lightweight, poorly toleranced enclosures. For these parts CHO-BOND® 360 adhesive, a coarser system, should be used (see Technical Bulletin 47). For all applications, CHO-BOND 584 adhesive performs well as a ground.

Because of its excellent adhesive properties, CHO-BOND 584 adhesive should not be used if the seam will be “broken” at a future time. As with most adhesives, bond strength deteriorates as the upper use temperature is exceeded. The fine particle, platelet-type pure silver filler generally assures a thin “glue line” in the range of 1-3 mils.

CHO-BOND 584 adhesive is available with two hardener systems. Hardener 29 combines room temperature cure capability with low viscosity, and hardener 208 provides room temperature cure and easy 50/50 mix ratio.

GENERAL PROCESSING INSTRUCTIONS

The mix proportion of self-contained CHO-PAK kits is conveniently premeasured. Simply squeeze or roll the two-chambered packet for a minute, snip off the end and apply. CHO-PAKs eliminate waste and weighing errors. Bulk material should be thoroughly mixed with a spatula (1 to 2 minutes) at high sheer. Mixed resin may then be applied to surfaces cleaned with solvent such as trichlorethylene or toluene. Better adhesion can be obtained with a sand blasted or chemically etched surface. CHOBOND 584 can be applied by spatula, dispensed from a syringe with 27 (max.) ga. needle, or silk screened.

Store unmixed components in tightly closed containers in a cool place. Do not dilute CHO-BOND 584 with any solvent without prior discussion of application details with Chomerics.

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This warranty comprises the sole and entire warranty pertaining to items provided hereunder. seller makes no other warranty, guarantee, or representation of any kind whatsoever. All other warranties, including but not limited to, merchant ability and fitness for purpose, whether expressed, implied, or arising by operation of law, trade usage, or course of dealing are hereby disclaimed. Notwithstanding the foregoing, there are no warranties whatsoever on items built or acquired wholly or partially, to buyer’s designs or specifications.

Limitation of remedy: Seller’s Liability arising from or in any way connected with the items sold or this contract shall be limited exclusively to repair or replacement of the items sold or refund of the purchase price paid by buyer, at seller’s sole option. In no event shall seller be liable for any incidental, consequential or special damages of any kind or nature whatsoever, including but not limited to lost profits arising from or in any way connected with this agreement or items sold hereunder, whether alleged to arise from breach of contract, expressed or implied warranty, or in tort, including without limitation, negligence, failure to warn or strict liability.

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