Phase Change Materials

THERMFLOW® phase-change Thermal Interface Materials (TIMs) completely fill interfacial air gaps and voids. They also displace entrapped air between power dissipating electronic components. Phase-change materials are designed to maximize heat sink performance and improve component reliability.

Upon reaching the required melt temperature, the pad will fully change phase and attain minimum bond-line thickness (MBLT) – less than 0.001 inch or 0.0254mm, and maximum surface wetting. This results in a low thermal resistance path.

At room temperature, THERMFLOW materials are solid and easy to handle. This allows them to be consistently and cleanly applied as dry pads to a heat sink or component surface. THERMFLOW material softens as it reaches component operating temperatures. With light clamping pressure it will readily conform to both mating surfaces.

This ability to completely fill air gaps and voids typical of component packages and heat sinks allows THERMFLOW pads to achieve performance superior to any other thermal interface materials.

Standard THERMFLOW products are electrically non-conductive however metal-to-metal contact is possible after the material undergoes phase-change, decreasing their electrical isolation properties. PC07DM-7 is the only phase-change materials recommended for use as a dielectric insulator.

Chomerics offers two types of phase change materials—traditional thermal interface pads and Dual Phase Change Polymer Solder Hybrids.


  • Low thermal impedance
  • Proven solution – years of production use in personal computer OEM applications
  • Demonstrated reliability through thermal cycling and accelerated age testing
  • Can be pre-applied to heat sinks
  • Protective release liner prevents contamination of material prior to final component assembly
  • Tabs available for easy removal of release liner (T710, T725*, T557, T777, PCO7DM) * T725 is only offered with a tab
  • Available in custom die-cut shapes, kiss-cut on rolls
  • RoHS Compliant

Typical Applications

  • Microprocessors
  • Graphics Processors
  • Chipsets
  • Memory Modules
  • Power Modules
  • Power Semiconductors

High temperature Gasket--Thermal Interface Materials--Phase Change Materials 1

*Phase-change material exhibits 1014 ohm-cm volume resistivity. Metal foil is electrically conductive.

**The phase-change material is electrically non-conductive. However, as it contains dispersed solder for enhanced thermal properties, it can exhibit through-conductivity at thinner bond line thickness (approximately <2 mils). It should not be used as an electrical insulator.

*** The lower phase-transition temperature is for the polymer. The higher value is for the low melting alloy filler.




  • Utilizes proven T725 phasechange material
  • Polyester dielectric layer offers excellent mechanical and electrical insulation properties
  • Inherently tacky – no adhesive required
  • Good thermal properties
  • Tabs available for easy removal


  • General use material
  • Good thermal performance
  • Low deflection force required
  • Fiberglass provides dielectric standoff
  • Only available with adhesive
  • Tabs available for easy removal


  • Excellent thermal performance
  • Inherently tacky – no adhesive required
  • Ideal for vertical applications
  • Sticky nature limits flowing in vertical applications
  • Tabs available for easy removal


  • Excellent thermal performance
  • Protective foil eliminates top liner
  • Inherently tacky – no adhesive required
  • Sticky nature limits flowing in vertical applications
  • Also available at 0.006”



  • Superior thermal performance
  • For attachment remove white release liner first
  • Dispersed solder filler offers added thermal performance
  • Resin system designed for higher temperature reliability
  • Inherently tacky – no adhesive required
  • Tabs available for easy removal


  • Superior thermal performance
  • Conformal foil allows clean break/rework and eliminates top liner
  • Dispersed solder filler offers added thermal performance
  • Resin system designed for higher temperature reliability
  • Inherently tacky – no adhesive required


  • Superior thermal performance
  • Ideal solution for mobile microprocessors
  • Dispersed solder filler offers added thermal performance
  • Resin system designed for higher temperature reliability
  • Inherently tacky – no adhesive required
  • Tabs available for easy removal


Download the Warranty

This warranty comprises the sole and entire warranty pertaining to items provided hereunder. seller makes no other warranty, guarantee, or representation of any kind whatsoever. All other warranties, including but not limited to, merchant ability and fitness for purpose, whether expressed, implied, or arising by operation of law, trade usage, or course of dealing are hereby disclaimed. Notwithstanding the foregoing, there are no warranties whatsoever on items built or acquired wholly or partially, to buyer’s designs or specifications.

Limitation of remedy: Seller’s Liability arising from or in any way connected with the items sold or this contract shall be limited exclusively to repair or replacement of the items sold or refund of the purchase price paid by buyer, at seller’s sole option. In no event shall seller be liable for any incidental, consequential or special damages of any kind or nature whatsoever, including but not limited to lost profits arising from or in any way connected with this agreement or items sold hereunder, whether alleged to arise from breach of contract, expressed or implied warranty, or in tort, including without limitation, negligence, failure to warn or strict liability.

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